About this book

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) by Muhannad S. Bakir and James D. Meindl, Editors is a book available to read on EtoBox.

<p>Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale SoC. This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.<br> <br> You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects. The volume spells out the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps

Author

Muhannad S. Bakir and James D. Meindl, Editors

Publisher

Artech House, Inc

Published

2009

Language

EN

ISBN

9781596932463

Subjects

Engineering, Technology, Stem