About this nonfiction
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) by Muhannad S. Bakir and James D. Meindl, Editors is a nonfiction available to read on EtoBox.
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.
It is typically read by self-directed learners exploring a subject in depth.
Common subject areas: history, science, philosophy, social sciences.
- Author
- Muhannad S. Bakir and James D. Meindl, Editors
- Publisher
- Artech House Publishers
- Published
- 2008
- Language
- EN
- ISBN
- 9781596932463
- Category
- nonfiction
- Subjects
- Engineering, Technology, Stem